A method and system for forming electrically conductive...

H - Electricity – 05 – K

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H05K 3/02 (2006.01) G01V 15/00 (2006.01) G06K 19/077 (2006.01) H01Q 1/22 (2006.01) H01Q 1/38 (2006.01) H05K 3/04 (2006.01)

Patent

CA 2444969

The present invention provides for a system and two methods for forming electrically conductive pathways. These pathways can be connected with a microchip in order to form a radio frequency identification tag. A first method uses a thermal transfer ribbon, coated with a conductive material that is engaged with a receiver substrate. A thermal print head will heat a composition on the thermal transfer ribbon in order to transfer it to the receiver substrate. This transfer composition forms the electrically conductive pathway or antenna. In an alternative method, a receiver substrate is heated in order to react conductive material thereon. This receiver substrate is also heated by a thermal print head to form an electrically conductive pathway.

La présente invention concerne un système et deux procédés permettant de former des chemins électroconducteurs. Ces chemins électroconducteurs peuvent être connectés au moyen d'une micropuce pour constituer une étiquette d'identification par radiofréquences. Un premier procédé fait appel à un ruban de transfert thermique recouvert d'une matière conductrice et couplé à un substrat de réception. Une tête d'impression thermique chauffe une composition se trouvant sur le ruban de transfert thermique pour la transférer sur le substrat de réception. Cette composition de transfert constitue le chemin électroconducteur ou antenne. Selon un autre procédé, un substrat de réception est chauffé pour former une matière réactive conductrice à sa surface. Ce substrat de réception est également chauffé par une tête d'impression thermique pour constituer un chemin électroconducteur.

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