A method of etching an opening

C - Chemistry – Metallurgy – 23 – F

Patent

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Details

C23F 1/02 (2006.01) B41J 2/16 (2006.01) H01L 21/302 (2006.01) H01L 21/306 (2006.01)

Patent

CA 2330998

The invention relates to a method for etching an opening, and more precisely, to etching in a silicon plate for creating a nozzle opening. According to the invention, one side of the silicon plate (1) is protected by a protective layer (2), and a recess (5) is made in the protective layer. Etching is made anisotropically through the recess so as to create a cavity (4) in the shape of a truncated pyramid of a predetermined depth in the silicon plate. The cavity is doped so as to create a doped layer (3) at the predetermined depth. The etching is then continued until the bottom surface of the cavity has passed the doped layer. Subsequently, etching is performed from the other side, while a voltage is applied to the doped layer, so as to free the nozzle opening at the other side. The invention enables an accurate control of the surface area of the nozzle opening. Through this, the amount of discharged fluid and the directional precision can be controlled very accurately.

L'invention se rapporte à un procédé de gravure d'un orifice, et plus précisément, de gravure permettant de former dans une plaque de silicium un orifice de buse. Conformément à cette invention, on protège une face de ladite plaque de silicium (1) par une couche protectrice (2) et l'on forme un évidement (5) dans la couche conductrice. La gravure est effectuée de manière anisotrope dans l'évidement de manière à créer une cavité (4) se présentant sous la forme d'une pyramide tronquée d'une profondeur préétablie dans la plaque de silicium. On dope ladite cavité de manière à former une couche dopée (3) à la profondeur préétablie. Puis on poursuit la gravure jusqu'à ce que la surface inférieure de la cavité ait dépassé la couche dopée. On procède ensuite à une gravure à partir de l'autre face, tout en appliquant une tension à la couche dopée, jusqu'à rencontrer l'ouverture de la buse de l'autre côté. Cette invention permet de maîtriser avec précision l'aire de surface de l'orifice de la buse. Il est ainsi possible de commander très exactement la quantité de liquide évacué ainsi que la précision de la direction du jet.

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