Adhesion of a photoresist to a substrate

H - Electricity – 01 – L

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356/183, 96/215

H01L 21/312 (2006.01) G03F 7/11 (2006.01)

Patent

CA 1184321

ABSTRACT OF THE DISCLOSURE A process for improving the adhesion of a photoresist to a substrate by applying a layer of titanium, zir- conium, hafnium and/or oxide thereof between the photoresist and substrate.

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