Glass-ceramic structures and sintered multilayer substrates...

Details Glass-ceramic structures and sintered multilayer substrates... Glass-ceramic structures and sintered multilayer substrates...

H - Electricity

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31/107, 356/12,

H01G 4/12 (2006.01) C03C 10/00 (2006.01) H01L 21/48 (2006.01) H01L 23/15 (2006.01) H05K 1/03 (2006.01)

Patent

CA 1109664

GLASS-CERAMIC STRUCTURES AND SINTERED MULTILAYER SUBSTRATES THEREOF WITH CIRCUIT PATTERNS OF GOLD, SILVER OR COPPER Abstract of the Disclosure Sintered glass-ceramic substrates containing multi-level, interconnected thick-film circuit patterns of highly conductive metals such as gold, silver or copper are provided which can be fired in air (for gold and silver) or in neutral atmospheres (for copper) at tem- peratures below the melting points of these metals. This has been made possible by the discovery that finely divided powders of certain glasses described herein sinter to essentially zero porosity at temperatures below 1000°C while simultaneously maturing to glass-ceramics-of low dielectric constant, high flexural strength and low thermal expansivity.

314417

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