High-intensity rotary peening particle support and method of...

B - Operations – Transporting – 24 – C

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

B24C 1/10 (2006.01) B21D 31/06 (2006.01) B23K 35/30 (2006.01) B23P 5/00 (2006.01) B24B 39/00 (2006.01) C21D 1/18 (2006.01) C21D 7/06 (2006.01)

Patent

CA 2080265

ABSTRACT OF THE DISCLOSURE Previously known peening particle supports fail under cyclic stresses encountered during peening operations. An improved high-intensity rotary peeningparticle support of the type having a plurality of peening particles metallurgically secured to an exposed face thereof is presented, the support having a base composition consisting essentially of from 0.08 to 0.34 weight percent carbon, the balance iron, and a Ni-enriched layer which provides a hard, wear resistant surface. A method of producing such a support is also described, the method including cold forming a peening particle support base composition as described,stress relieving, metallurgically joining peening particles to an exposed face of the support, austenitizing, quenching, and tempering the support to form a support having a Ni-enriched layer which is harder than the base composition.

LandOfFree

Say what you really think

Search LandOfFree.com for Canadian inventors and patents. Rate them and share your experience with other people.

Rating

High-intensity rotary peening particle support and method of... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with High-intensity rotary peening particle support and method of..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High-intensity rotary peening particle support and method of... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFCA-PAI-O-1354767

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.