Rotary electroplating cell with controlled current distribution

C - Chemistry – Metallurgy – 25 – D

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C25D 5/04 (2006.01) C25D 5/08 (2006.01)

Patent

CA 1206436

ROTARY ELECTROPLATING CELL WITH CONTROLLED CURRENT DISTRIBUTION Abstract of the Disclosure An apparatus and a method for rotary electroplating a thin metallic film having a uniform thickness and composition throughout. The apparatus includes a flow-through jet plate having nozzles of radially increasing size and uniformly spaced radially therethrough, or nozzles of the same size with varying radial spacing therebetween so as to provide a differential flow distribution of the plating solution that impinges on the wafer-cathode where the film is deposited. The spacing and size of the nozzles are critical to obtaining a uniform thickness. The electrical currents to the wafer and to a thieving ring are controlled by variable resistors so as to keep the electrical current to the cathode constant throughout the plating process. In a preferred embodiment the flow-through jet plate has an anode associated therewith in which the exposed area of the anode is maintained at a constant amount during the deposition. This method can simultaneously deposit with a uniform thickness and composition elements having a minimum gap or part size of 1 micrometer or less.

386420

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