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John T. White

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Country: Canada

Churn

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Patent

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Electrochemical surface analysis using gel electrolyte

G - Physics – 01 – N
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Improved copper bath for electroplating fine circuitry on...

C - Chemistry – Metallurgy – 25 – D
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Integrated circuit plating using highly-complexed copper...

H - Electricity – 01 – L
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Churn

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Profile ID: LFCA-PAI-P-894589

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