Vapor bonding method

Details Vapor bonding method Vapor bonding method

B - Operations, Transporting

23

K

113/89

B23K 1/015 (2006.01) B23K 35/38 (2006.01) H05K 3/34 (2006.01)

Patent

CA 1073275

VAPOR BONDING METHOD ABSTRACT OF THE DISCLOSURE Components, printed circuit board assemblies and the like to be interconnected by soldering are appropriately fluxed and placed in an atmosphere of a saturated vapor derived from a heat transfer liquid medium having a boiling point above the melting point of the solder. The heat transfer medium is chosen to have a solubility parameter compatible with the solu- bility parameter of the flux to eliminate the need for subsequent flux cleaning. An alternate embodiment includes a fatty acid in the heat transfer medium, which under some circum- stances can eliminate the need to apply flux to the assembly being soldered.

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