Water-dispersible hot melt adhesives and products using same

Details Water-dispersible hot melt adhesives and products using same Water-dispersible hot melt adhesives and products using same

C - Chemistry, Metallurgy

08

L

154/134, 400/170

C08L 51/08 (2006.01) B32B 29/00 (2006.01) C08F 283/06 (2006.01) C09J 151/08 (2006.01)

Patent

CA 1037175

ABSTRACT OF THE DISCLOSURE A water-dispersible hot melt adhesive comprises 75-95 parts of a graft copolymer of about 40-80% vinyl monomer and about 20-60% by weight of water-soluble poly- alkylene oxide polymer, and 5-25 parts by weight tackifying resin. The water-soluble polyalkylene oxide polymer has a molecular weight of about 3000 to 20,000 and a polymerized ethylene oxide content of at least 50% by weight. The vinyl monomer is preferably a vinyl acetate or low molecular weight alkyl-substituted acrylate. The adhesive is prefer- ably 75-85% copolymer and 15-25% by weight tackifying resin.

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