Plated polyphenylene ether resin compositions containing...

C - Chemistry – Metallurgy – 08 – J

Patent

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C08J 9/26 (2006.01) C08L 51/06 (2006.01) C08L 71/12 (2006.01)

Patent

CA 1116356

8CH-2651 ABSTRACT OF THE DISCLOSURE Novel plated compositions are disclosed which include a polyphenylene ether resin, a small particle EPDM saturated rubber-modified alkenyl aromatic resin, and a hydrogenated A-B-A block copolymer. Also included within the scope of this invention are reinforced and flame-retardant compositions of said polyphenylene ether resin, said alkenyl aromatic resin modified with an EPDM rubber, and said hydrogenated elastomeric block copolymer. The resins of the instant applica- tion are particularly well suited to metal plated applications where decoration, U.V. resistance or electric conductivity are desired.

315469

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