Dressing and conditioning resin-bonded diamond grinding wheel

B - Operations – Transporting – 24 – B

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B24B 1/00 (2006.01) B24B 53/00 (2006.01)

Patent

CA 1129207

RD-11,745 ABSTRACT OF THE DISCLOSURE A method comprising contacting a wetting liquid with the surface of a resin-bonded diamond grinding wheel, wetting and forming a film on the face of the resin component of the wheel surface, and grinding the resulting wetted wheel surface with a silicon carbide or silicon nitride ceramic body generating ceramic chips which adhere to said wetted resin face forming a slurry layer thereon which simultaneously dresses and conditions said wheel during grinding.

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