Aluminium diffusion method for semiconductors

H - Electricity – 01 – L

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

356/136

H01L 21/225 (2006.01) H01L 21/761 (2006.01) H01L 21/78 (2006.01)

Patent

CA 1048161

ABSTRACT OF THE DISCLOSURE Diffusion of aluminium into a silicon semi- conductor wafer from an annular or grid pattern of depositied metallic aluminium to form a p-type annular zone at least 75 microns deep. The diffusion is performed in an oxidizing atmosphere to inhibit aluminium contamination of the wager portion bounded by the p-type annular zone and in which for instance a thyristor may subsequently be formed. The aluminium may be diffused through the whole thickness of the wager to form a peripheral zone of the thyristor body. Figure 3 is suitable for publication. -25-

248047

LandOfFree

Say what you really think

Search LandOfFree.com for Canadian inventors and patents. Rate them and share your experience with other people.

Rating

Aluminium diffusion method for semiconductors does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Aluminium diffusion method for semiconductors, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Aluminium diffusion method for semiconductors will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFCA-PAI-O-112092

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.