Producing printed circuits by conjoining metal powder images

Details Producing printed circuits by conjoining metal powder images Producing printed circuits by conjoining metal powder images

H - Electricity

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H05K 3/00 (2006.01) H05K 3/10 (2006.01) H05K 3/18 (2006.01) H05K 3/24 (2006.01) H05K 3/26 (2006.01) H05K 3/38 (2006.01) H05K 3/34 (2006.01)

Patent

CA 1131789

PD 1601 Title Producing Printed Circuits By Conjoining Metal Powder Images Abstract By the process of this invention, printed cir- cuits are prepared containing an electrically conductive wiring trace from materials having adherent and non- adherent surface areas, e.g., printed circuit substrates bearing an imaged photoadhesive layer. Onto the adherent surface areas of the material are applied ductile metal or alloy particles, and any excess parti- cles are removed from the non-adherent areas. The metallized areas are conjoined, e.g., with silicon carbide brush or rounded metal rod. The conjoined areas can be electrolessly plated, electroplated or soldered. Multilayer printed circuits can also be prepared by repeating these steps with additional layers of photoadhesive material adhered to underlying printed circuits.

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