H - Electricity – 01 – H
Patent
H - Electricity
01
H
306/157
H01H 85/04 (2006.01) H01H 85/042 (2006.01) H01H 85/06 (2006.01)
Patent
CA 1091731
HIGH SPEED RATIO, DUAL FUSE LINK ABSTRACT OF The DISCLOSURE A relatively low cost dual element fuse link including a meltable solder junction has a pair of thermally insulated, serpentine, fusible elements supported on opposite sides of the junction for increasing the heat transferred to the junction by the elements in response to a given current carried by the link such that the junction will be caused to melt at lower current values thereby providing the link with an increased speed ratio. A pair of cylindrical porcelain insulators disposed along respective serpentine elements present the desired thermal insultation as well as provide structural stability to the elements precluding deformation of their serpentine shape when the fuse link is under tension as in a distribution system cutout. The serpentine shape of the elements presents an increased element length which in turn reduces the temperature gradient along the elements thereby reducing axial conductive heat loss from the ends of the elements remote from the solder junction.
295257
A. B. Chance Company
Gowling Lafleur Henderson Llp
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