Composition for wetting hydrophobic capillary materials and...

C - Chemistry – Metallurgy – 11 – D

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C11D 17/08 (2006.01) B01F 17/36 (2006.01) D06M 13/144 (2006.01) D06M 13/192 (2006.01) D06M 13/207 (2006.01) D06M 13/224 (2006.01) D06M 13/328 (2006.01) D06M 13/368 (2006.01) D06M 13/432 (2006.01) D06P 1/649 (2006.01) D06P 1/651 (2006.01)

Patent

CA 1340844

There are disclosed compositions for wetting hydrophobic capillary materials, which compositions contain, in addition to a water-soluble anionic, cationic or amphoteric surfactant or a mixture thereof, an amphiphilic, phosphorus-free organic compound which is very slightly soluble in water, has a melting point below 4°C, and a boiling point above 200°C.

606553

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