Electroless gold plating

Details Electroless gold plating Electroless gold plating

C - Chemistry, Metallurgy

23

C

6/4, 117/77

C23C 18/44 (2006.01)

Patent

CA 1183656

ABSTRACT OF THE DISCLOSURE Improved electroless or autocatalytic gold plating baths wherein the gold ingredient is a water soluble tri- valent gold component selected from an alkali metal auri- cyanide, an alkali metal aurihydroxide, and an alkali metal aurate. The bath contains an amino borane, an alkali metal borohydride, or an alkali metal cyanoborohydride as the reducing agent, an alkaline agent such as an alkali metal hydroxide; and an alkaline buffering agent. Optionally, the bath may contain added alkali metal cyanide. The method of utilizing such electroless or autocatalytic plating bath for depositing gold on metallic substrates such as gold, copper, copper alloys, electroless copper, electroless nickel, nickel, nickel alloys, etc. and on a non-metallic substrates is also described and claimed.

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