Forging die package

Details Forging die package Forging die package

B - Operations, Transporting

21

J

78/29

B21J 5/00 (2006.01) B21J 13/02 (2006.01) B21K 1/36 (2006.01)

Patent

CA 1212267

- 24 - Abstract Forging Die Package A die package for forming a central disc structure having a plurality of integrally formed appendages extending therefrom includes a cylindrical array of appendage forming, abutting die segments which are prevented from tilting or moving in a circumferential direction by means of pins extending into slots formed along the parting lines between abutting die segments in the upper surfaces of the segments. In one embodiment, the pins extend upwardly from between opposed, parallel, radially and axially extending walls of each slot and fit tightly between said walls. The upper ends of the pins are secured to a rigid annular ring overlying the slots. The slots extend radially inwardly of the pins to allow the die segments to be moved radially outwardly after forging to release the forging from the die package.

453848

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