Reinforced plastic laminates for use in printed circuit...

Details Reinforced plastic laminates for use in printed circuit... Reinforced plastic laminates for use in printed circuit...

B - Operations, Transporting

32

B

356/1, 154/70.04

B32B 5/12 (2006.01) B31C 99/00 (2009.01) B29B 15/10 (2006.01) B29C 53/56 (2006.01) B29C 53/76 (2006.01) B29C 53/80 (2006.01) B29C 70/20 (2006.01) B29C 70/34 (2006.01) H05K 1/03 (2006.01) H05K 3/00 (2006.01)

Patent

CA 1294712

ABSTRACT OF THE DISCLOSURE A warp-free laminate is produced by winding a first set of strands or filaments about a flat mandrel with a second set of strands being wound transverse to the first set. The two set may be perpendicular to each other. The filaments are maintained under a controlled tension while being impregnated with a resin and during subsequent cure of the resin. In order to permit the formation of a warp-free product the winding pattern is such that it forms a mirror image about a neutral axis or plane of symmetry. The winding pattern may be chosen to provide interstices in a predetermined pattern permitting punching out or high speed drilling of hole openings for subsequent printed circuit applications.

546838

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