Method for constructing an electrical interconnection...

H - Electricity – 05 – K

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H05K 3/20 (2006.01) H05K 13/06 (2006.01) H05K 3/22 (2006.01)

Patent

CA 1179837

ABSTRACT OF THE DISCLOSURE Method and apparatus for producing an electri- cal interconnection circuit for electronic components in which an insulating base support incorporating con- ductive zones is used, the different conductive zones to be interconnected are joined by an insulated wire by adhering it to the base support, the bared wire is soldered to the conductive zones and is cut after soldering, wherein a thermally solderable insulated wire is used and liquid flux is deposited on the parts of the wire to be soldered resting on the conductive zones before soldering.

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