H - Electricity – 05 – K
Patent
H - Electricity
05
K
356/22, 356/8
H05K 13/04 (2006.01) H05K 3/30 (2006.01)
Patent
CA 1199422
METHOD AND APPARATUS FOR MOUNTING MULTILEAD COMPONENTS ON A CIRCUIT BOARD Abstract A method for mounting one or a plurality of multilead components on a circuit board is herein disclosed. The method comprises the steps of loading a releasable template with the component/components to be mounted, positioning the releasable template proximate to the board, releasing the component/components from the template onto the board such that each lead of each component is proximate to a corresponding aperture in the board, and imparting a vibratory motion to the board thereby inserting the component/components into the board. Also disclosed are various embodiments of an apparatus for achieving this mounting method using a programmable robotic arm.
428809
Hoffman Brian D.
Pollack Steven H.
Weissman Barry
Kirby Eades Gale Baker
Western Electric Company Incorporated
LandOfFree
Method and apparatus for mounting multilead components on a... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method and apparatus for mounting multilead components on a..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for mounting multilead components on a... will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1175107