Grooved heat pipe cooling apparatus for semiconductors

Details Grooved heat pipe cooling apparatus for semiconductors Grooved heat pipe cooling apparatus for semiconductors

H - Electricity

01

L

356/113

H01L 25/04 (2006.01)

Patent

CA 1295054

Abstract of the Disclosure A heat pipe type cooling apparatus for a semicon- ductor, comprises a plurality of first copper pipes, each of the first pipes having a plurality of V-shaped grooves formed in an inner surface thereof and arranged in a circumferential direction thereof, and a plurality of second copper pipes, each of the second pipes having a plurality of second grooves formed in an inner surface thereof, each of the second grooves having an opening narrower than an inner part thereof. A plurality of ceramic pipes connect the first pipes and the second pipes, through intermediate pipes made of a nickel-iron alloy. One end of each of the second pipes is inserted in a metal block on which a semiconductor is mounted.

586083

Affiliated with

Also associated with

Rating

Grooved heat pipe cooling apparatus for semiconductors does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Grooved heat pipe cooling apparatus for semiconductors, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Grooved heat pipe cooling apparatus for semiconductors will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1175498