Self-aligning, self-loading semiconductor clamp

H - Electricity – 01 – L

Patent

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356/194

H01L 23/12 (2006.01) H01L 23/32 (2006.01) H01L 23/48 (2006.01) H05K 7/12 (2006.01)

Patent

CA 1218766

49,910 ABSTRACT OF THE DISCLOSURE The present invention is a self-aligning clamp for a compression bonded semiconductor device that can be assembled without the use of a press. The self-aligning is accomplished with the use of a ball and socket com- ponent and the compression is controlled by the use of Belleville washers designed for a specific force.

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