Semiconductor integrated circuit including a lead frame chip...

Details Semiconductor integrated circuit including a lead frame chip... Semiconductor integrated circuit including a lead frame chip...

H - Electricity

01

L

356/146

H01L 23/50 (2006.01) H01L 23/495 (2006.01)

Patent

CA 1201820

-5- SEMICONDUCTOR INTEGRATED CIRCUIT INCLUDING A LEAD FRAME CHIP SUPPORT Abstract In an integrated circuit package, the central "paddle" of the lead frame on which the semiconductor chip (17) is mounted comprises two separate, electrically isolated portions (10,11) which extend beyond edges of the chip and which is each electrically connected to a different terminal pin of the package. External power is applied to these two chip support portions by means of which electrical power can be distributed to numerous areas (as desired) on the chip via bonding wires (23,24) extending between the chip areas and the paddle portions (FIG. 2).

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