Process for treating copper-nickel alloys for use in brazed...

Details Process for treating copper-nickel alloys for use in brazed... Process for treating copper-nickel alloys for use in brazed...

C - Chemistry, Metallurgy

22

F

148/10, 113/83

C22F 1/08 (2006.01)

Patent

CA 1247505

-16- ABSTRACT The present invention relates to a process for maintaining the fine grain size of and providing excellent bend formability, hot ductility and strength properties to a copper-nickel-manganese alloy to be exposed to elevated temperatures. The process of the present invention includes a final cold working step during which the material to be fabricated into a desired article and/or exposed to the elevated temperatures has its thickness reduced by about 4% to about 30%, preferably from about 5% to about 25%. The alloys described herein have particular utility in brazed articles or assemblies.

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