Polypropylene resin film for aluminum deposition

C - Chemistry – Metallurgy – 08 – K

Patent

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Details

400/6574, 400/94

C08K 5/00 (2006.01) C08L 23/00 (2006.01) C08L 23/12 (2006.01)

Patent

CA 1199140

ABSTRACT OF THE DISCLOSURE A film for aluminum deposition which is produced from a resin composition comprising a blend of 100 parts by weight of polypropylene resin with (i) 0.01 to 0.2 part by weight of an antioxidant having a melting point of 80C or higher and (ii) 0 to 0.5 part by weight of an antiblocking agent, and which contains 5 wt% or less of cold xylene soluble matters. The film of the invention is greatly improved in adhesion to aluminum.

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