Process for mounting chip type circuit elements on printed...

Details Process for mounting chip type circuit elements on printed... Process for mounting chip type circuit elements on printed...

H - Electricity

05

K

356/22, 356/9

H05K 3/30 (2006.01) H01L 21/683 (2006.01) H05K 13/04 (2006.01)

Patent

CA 1239482

PROCESS FOR MOUNTING CHIP TYPE CIRCUIT ELEMENTS ON PRINTED CIRCUIT BOARDS AND APPARATUS THEREFORE ABSTRACT OF THE DISCLOSURES A process for mounting chip type circuit elements on printed circuit boards and an apparatus therefore are disclosed which is capable of eliminating necessity of arranging an X-Y table to simplify the structure of the apparatus and decreasing a time required to mount one circuit element on a printed circuit board. Chip type circuit elements are sucked up by a plurality of suction pins arranged in each mounting head, transferred to a centering and turning section and then progressively mounted on a printed circuit board. The mounting head is adapted to carry out the reciprocating movement in the X-direction plural times while it carries out the reciprocating movement in the Y-direction one time.

490861

Affiliated with

Also associated with

Rating

Process for mounting chip type circuit elements on printed... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for mounting chip type circuit elements on printed..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for mounting chip type circuit elements on printed... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1190984