Evaporation cooling module for semiconductor devices

Details Evaporation cooling module for semiconductor devices Evaporation cooling module for semiconductor devices

H - Electricity

02

B

356/3

H02B 1/00 (2006.01) H05K 7/20 (2006.01)

Patent

CA 1249063

ABSTRACT OF THE DISCLOSURE An improved evaporation cooling module for cooling semiconductor chips bonded onto circuit boards that are immersed in a coolant is disclosed. A heat exchanger that condenses the evaporated gas of the coolant is immersed in the coolant liquid, and is provided with bubble traps. The bubble traps are made from a porous metal that collect the bubbles of the evaporated coolant so that they accumulate around the heat exchanger. As a result, the liquefaction efficiency of the coolant is increased, although the heat exchanger is immersed in the coolant. The circuit board is provided with a bubble guide which separates the bubbles of coolant from the surface of the circuit board, and guides them to the bubble trap. Such guided motion of the bubbles causes a local convection current of the coolant, thus further increasing the liquefaction efficiency and improving the uniformity of the temperature distribution over the circuit board. Since the heat exchanger is placed in the coolant, its liquefaction efficiency does not decrease, as it is separated from the extracted gas which is released from various parts in the module. Thus, degassing is unnecessary and maintenance is simplified.

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