But-1-ene molding resin blends

C - Chemistry – Metallurgy – 08 – L

Patent

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400/4919

C08L 23/20 (2006.01)

Patent

CA 1311070

ABSTRACT OF THE DISCLOSURE A composition is disclosed comprising a blend of from 50 to 80% by weight of an isotactic but-1-ene homopolymer having a melt index of 225 or less, from 13.5 to 40% by weight of a stabilized propylene polymer and from 0.02 to 1.5% by weight of high density polyethylene. A mold release agent may be included in an amount of 0.1 to 1% by weight. Molded articles made from the composition are also disclosed.

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