Resin composition curable at low temperature

Details Resin composition curable at low temperature Resin composition curable at low temperature

C - Chemistry, Metallurgy

08

F

402/16

C08F 8/00 (2006.01) C08F 8/42 (2006.01) C08F 230/08 (2006.01) C08J 3/24 (2006.01) C09D 155/00 (2006.01)

Patent

CA 1296467

ABSTRACT OF THE DISCLOSURE: This invention provides a resin composition curable at a low temperature and characterized in that the composition comprises: (a) a vinyl copolymer prepared from a polysiloxane macromonomer and an epoxy-containing vinyl monomer, the polysiloxane macromonomer being prepared by reacting 70 to 99.999 mole % of a compound (A) represented by the formula Image (I) wherein R1 is an aliphatic hydrocarbon group having 1 to 8 carbon atoms or phenyl, and R2, R3 and R4 are each alkoxyl having 1 to 4 carbon atoms or hydroxyl with 30 to 0.001 mole % of a compound (B) represented by the formula Image (II) wherein R5 is a hydrogen atom or methyl, R6, R7 and R8 are each hydroxyl, alkoxyl having 1 to 4 carbon atoms or an aliphatic hydrocarbon group having 1 to 8 carbon atoms, at least one of R6, R7 and R8 being hydroxyl or alkoxyl, and n is an integer of 1 to 6, the polysiloxane macromonomer having per molecule at least two functional groups selected from hydroxyl and the alkoxyl and being 400 to 100000 in number average molecular weight, the epoxy-containing vinyl monomer having at its terminal end the group Image wherein (Z) forms an alicyclic group along with the C-C bond, and (b) a 6-coordinate organoaluminum chelate compound and/or an 8-coordinate organozirconium chelate compound.

559708

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