Electroless copper bath and process

Details Electroless copper bath and process Electroless copper bath and process

C - Chemistry, Metallurgy

23

C

117/231, 6/4

C23C 18/40 (2006.01)

Patent

CA 1248705

ABSTRACT OF THE DISCLOSURE An aqueous alkaline electroless copper plating solution and process for depositing adherent uniform copper deposits on a substrate. The solution contains copper ions in an amount sufficient to deposit copper, a reducing agent in an amount sufficient to reduce the copper ions present to the metallic state, hydroxyl ions to provide a pH on the alkaline side and a composite complexing agent comprising an amine compound selected from the group consisting of ethylenediaminetetraacetic acid and N,N,N',N'-tetrakis (2-hydroxypropyl) ethylenediamine and a hydroxy acid selected from the group consisting of gluconic acid and glucoheptonoic acid as well as the bath soluble and compatible salts and partial salts thereof as well as mixtures thereof in which the hydroxy acid compound is present relative to the amine compound at a mol ratio of about 0.1 to about 3:1. The synergistic effect of the use of the controlled combination of complexing agents provides for bath stability and commercially acceptable plating rates of adherent, ductile bright copper deposits over a broad range of temperatures, pH and processing conditions. 21

474448

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