C - Chemistry – Metallurgy – 04 – B
Patent
C - Chemistry, Metallurgy
04
B
261/1, 25/134, 3
C04B 35/64 (2006.01) C04B 35/581 (2006.01) H01B 3/08 (2006.01) H01L 21/48 (2006.01) H01L 23/12 (2006.01) H01L 23/15 (2006.01) H01L 23/498 (2006.01) H05K 1/03 (2006.01) H05K 3/46 (2006.01)
Patent
CA 1332176
ABSTRACT OF THE DISCLOSURE An electronic package comprising dielectric layers including a densified aluminum nitride (AlN) base layer and at least one densified AlN-borosilicate glass composite layer bonded thereto is described. Any of the dielectric layers may be metallized with conductive circuit patterns and can contain conductive vias. Production of this package is accomplished by hot pressing a greenware laminate comprising a densified base (e.g., AlN); at least one green sinterable sheet (e.g., AlN-borosilicate glass composite); and a green sheet of non-sinterable material (e.g., boron nitride [BN]). The respective green sheets comprise homogeneous mixtures of the ceramic powders and a binder, e.g., polyethylene. The polyethylene is burnt off during the hot press operation. Residual BN is removed by brushing and/or grit blasting, leaving the finished electronic package, all ceramic elements of which are densified. The package provides superior thermal conductivity, strength, dielectric properties, and silicon-compatibility.
611744
Enloe Jack Harrison
Lau John Wing-Keung
Rice Roy Warren
Gowling Lafleur Henderson Llp
W.r. Grace & Co.,-Conn.
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