Process for removing contaminant

B - Operations – Transporting – 23 – K

Patent

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Details

204/96.05, 148/3

B23K 10/00 (2006.01) H05K 3/00 (2006.01)

Patent

CA 1314197

EN984-029 PROCESS FOR REMOVING CONTAMINANT ABSTRACT Contaminant is removed from holes by etching in a gaseous plasma by first removing contaminant from the vicinity of the edges of the hole. Next, a mask is provided in the vicinity of the edges to prevent etching by contacting with a gaseous plasma which is different from the gaseous plasma employed in the first etching step. The holes are then etched in a gaseous plasma to remove contaminant from the interior of the holes in the vicinity of the center of the holes, whereby the mask protects the edges from being etched.

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