C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
356/143, 18/60,
C08L 81/04 (2006.01) C08K 3/36 (2006.01) C08K 5/54 (2006.01) C08K 7/14 (2006.01) C08K 7/20 (2006.01) C08K 13/04 (2006.01) H01B 3/30 (2006.01)
Patent
CA 1200946
Abstract A composition, suitable for encapsulation-type molding, contain- ing from about 30 to about 50 weight percent poly (arylene sulfide), about 10 to about 30 weight percent glass fibers, about 30 to about 60 weight percent of a component that can be glass beads or fused silica and about 0.5 to about 3 weight percent of organic silane. Preferably the composition also contains up to about 2 weight percent of a processing aid. A method for preparing a composition suitable for molding in which there is compounded a masterbatch of glass fiber and poly (arylene sul- fide), the masterbatch is reduced to particles, and the masterbatch par- ticles are blended with a sufficient amount of organic silane, additional poly (arylene sulfide) and a component chosen from glass beads and fused silica to provide a composition of about 30 to about 50 weight percent poly (arylene sulfide), about 10 to about 30 weight percent glass fibers, to about 3 weight percent organic silane. An article of manufacture com- prising a semiconductor chip encapsulated in a molded composition are des- cribed above.
395200
Osler Hoskin & Harcourt Llp
Phillips Petroleum Company
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