Surface mountable microwave ic package

Details Surface mountable microwave ic package Surface mountable microwave ic package

H - Electricity

05

K

333/101, 356/8

H05K 1/02 (2006.01) H01L 23/66 (2006.01) H05K 1/11 (2006.01) H05K 3/34 (2006.01)

Patent

CA 1240373

-9- ABSTRACT A surface mountable microwave IC package uses printed transmission lines on a printed circuit board in lieu of plumbing between milled packages. A backside co-planar waveguide is connected to a topside microstrip line by a through-hole in a carrier substrate. To compensate for inductance added by the hole and transmission line ends, a gap is adjusted to provide compensation capacitance. Hermeticity is assured by brazing lead frame over the through-hole and using a solder sealed lid. The lid provides both hermeticity and shielding.

502853

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