Electronic component mounting apparatus

Details Electronic component mounting apparatus Electronic component mounting apparatus

H - Electricity

05

K

356/22

H05K 13/04 (2006.01)

Patent

CA 1320005

ABSTRACT OF THE DISCLOSURE An electronic component or chip mounting apparatus capable of carrying out a chip mounting operation at a high speed and with high accuracy. The apparatus includes two transition stations, a chip extracting head reciprocating between a chip feed section and the transition stations and two chip depositing heads arranged for reciprocating between the transition stations and a substrate on which a chip is to be mounted so that a chip mounting operation may be carried out according to a reciprocating relay system and an, operation of depositing the chip on the subtrate may place with high efficiency.

602967

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