Assembly-heat sink for semiconductor devices

Details Assembly-heat sink for semiconductor devices Assembly-heat sink for semiconductor devices

H - Electricity

01

L

356/113

H01L 23/34 (2006.01) H01L 23/40 (2006.01)

Patent

CA 1214574

17 ABSTRACT OF THE DISCLOSURE The present invention is directed to an assembly- heat sink for semiconductor fusions. The fusions are disposed within the assembly-heat sink between cylindrical metal members which both cool the fusions and facilitate making electrical contact to the fusions. Top and bottom members of the assembly-heat sink, which entirely enclose the cylindrical members and the fusions are comprised entirely of metal permitting the assembly-heat sink to be cooled from three sides. The fusions are electrically insulated from the top and bottom members of the assembly- heat sink.

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