Method by means of which an electronic circuit can be...

G - Physics – 06 – K

Patent

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Details

356/197, 317/3

G06K 19/06 (2006.01) G06K 19/077 (2006.01) H01L 23/60 (2006.01) H05F 1/00 (2006.01) H05K 9/00 (2006.01)

Patent

CA 1204529

ABSTRACT: In order to protect an integrated circuit accommodated in a flat support, such as especially an electronic identification card, from electrostatic charges, it is well known to cover the two faces of this circuit with a conducting foil. The problem, which then arises, consists in the interconnection of the foils covering each of the faces. The present invention overcomes this problem by pro- viding a method which interconnects the foils by forming a hole in the support between the two aforementioned foils, causing a part of the material of the surface foils to penetrate into this hole, exerting a pressure and simultaneously carrying out a thermal treat- ment on the foil in the vicinity of the hole.

415808

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