Resin glass filled deep trench isolation

Details Resin glass filled deep trench isolation Resin glass filled deep trench isolation

H - Electricity

01

L

356/151

H01L 29/30 (2006.01) H01L 21/3105 (2006.01) H01L 21/312 (2006.01) H01L 21/461 (2006.01) H01L 21/762 (2006.01)

Patent

CA 1232371

ABSTRACT OF DISCLOSURE A method of forming trench/dielectric by coating trench walls and substrate surface with MgO followed by filling the trenches with a resin glass. The MgO layer is used for RIE planarization etchback of the resin glass to level of the trenches.

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