Printed circuit board structure for metal package containing...

Details Printed circuit board structure for metal package containing... Printed circuit board structure for metal package containing...

H - Electricity

05

K

356/11, 356/21

H05K 1/02 (2006.01) H03H 9/10 (2006.01) H05K 3/34 (2006.01)

Patent

CA 1202733

ABSTRACT According to the present invention, there is provided a printed circuit board structure mounting a metal package with a circuit component for use in a high-frequency region contained therein. The structure comprises a grounding hole bored partially in an area of the printed circuit board under the metal package; and means for connecting the metal package with con- ductors on the printed circuit board via the grounding hole. A method for making the structure is also disclosed.

456035

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