C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
400/4506, 400/57
C08L 33/06 (2006.01)
Patent
CA 1212190
CURABLE MOLDING COMPOSITIONS CONTAINING A POLYESTER RESIN ABSTRACT OF THE DISCLOSURE Described herein are curable molding compositions comprising a mixture of: (a) an unsaturated polyester; (b) acrylic or methacrylic acid or a functionalized derivative thereof having a molecular weight of less than 300; (c) an ethylenically unsaturated monomer which is soluble in and copolymerizable with (a) and (b) and which is different from (b); and (d) one or more fibers with a melting point or a glass transition temperature above about 130°C. S P E C I F I C A T I O N - 1 -
404936
Hopley William G.
Union Carbide Corporation
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