Method and apparatus for venting vacuum processing equipment

H - Electricity – 01 – L

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356/182, 356/187

H01L 21/00 (2006.01) C23C 16/52 (2006.01) C30B 25/14 (2006.01)

Patent

CA 1301958

Abstract of the Disclosure Controlled, low-turbulence venting of a semiconductor processing vacuum chamber is provided by a venting system including sensing elements for sensing gas conditions, including pressure, in the chamber during venting, and vent rate control elements, including a flow rate regulator valve, responsive to the sensing elements for attaining a venting rate approaching a selected maximal venting rate threshold of sonically choked flow, thereby attaining enhanced non-sonically-choked venting.

601822

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