Optical module

Details Optical module Optical module

G - Physics

02

B

345/62, 88/97.7

G02B 6/42 (2006.01) H01L 31/0203 (2006.01)

Patent

CA 1328183

Abstract of the Disclosure In an optical module with a substrate having an optical unit mounted thereon being provided on a bottom of a package and having the optical unit optically coupled with an end of an optical fiber extending into the package, a chip carrier including the optical unit is die-bonded to a conductive land formed on the substrate, and a recess is formed at an area of the bottom of the package which faces the land. Thus, a capacitance of a parallel-plate capacitor formed by the land and the bottom of the package, which prevents a high speed operation, is rendered negligibly small.

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