Thick film conductor compositions

B - Operations – Transporting – 05 – D

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356/12, 31/166

B05D 5/12 (2006.01) H01B 1/16 (2006.01) H01C 17/28 (2006.01) H01L 21/48 (2006.01) H05K 1/09 (2006.01)

Patent

CA 1228475

TITLE THICK FILM CONDUCTOR COMPOSITIONS ABSTRACT A copper-containing thick film conductor composition comprising a mixture of finely divided particles of (a) a conductive material containing copper metal, (b) inorganic binder and (c) 0.2-5% wt. of a noncuprous metal selected from the group consisting of tungsten, molybdenum, rhenium and alloys and mixtures thereof all dispersed in organic medium. The metal particles must be within certain narrow ranges of particle size.

461683

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