B - Operations – Transporting – 05 – D
Patent
B - Operations, Transporting
05
D
32/1, 117/61
B05D 5/12 (2006.01) B05C 5/02 (2006.01) H05K 3/00 (2006.01) H05K 3/28 (2006.01)
Patent
CA 1258990
ABSTRACT OF THE DISCLOSURE Method and apparatus for applying a flow of insulating mate- rial such as silicone to predetermined locations on printed cir- cuit boards to avoid damaging the components on the circuit boards, such as solenoids and buzzers, whose functions will be impaired by the application of such material thereto. The appa- ratus is comprised of a pump which delivers a flow of insulating material to a manifold, the manifold having a plurality of lengths of flexible tubing attached thereto which serve as noz- zles for dispensing the flow of insulating material. A printed circuit board is mounted on a conveyor and the conveyor is ad- vanced until the printed circuit board is under the manifold, at which time the manifold is lowered to place the nozzles in close proximity to the printed circuit board so that the flow of in- sulating material will be directed to predetermined locations on the printed circuit board. The flexible nozzles are selectively positioned to direct the flow to those predetermined locations. A wave coating apparatus is provided to coat the bottom of the printed circuit board.
527233
Osler Hoskin & Harcourt Llp
Weiswurm Klaus D.
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