Thick film conductor compositions

H - Electricity – 01 – B

Patent

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31/142, 117/64,

H01B 1/16 (2006.01) C22C 32/00 (2006.01) H05K 1/09 (2006.01)

Patent

CA 1206779

TITLE THICK FILM CONDUCTOR COMPOSITIONS ABSTRACT OF THE DISCLOSURE Metallization suitable for making printed thick film terminations comprising an admixture of finely divided particles of palladium/silver as the conductive phase and bismuth-free low-melting, low viscosity devitrifiable glass as the binder phase. The composition optionally contains a spinel-forming metal oxide to raise substrate adhesion.

408364

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