Single component, latent curing epoxy resin composition

Details Single component, latent curing epoxy resin composition Single component, latent curing epoxy resin composition

C - Chemistry, Metallurgy

08

G

402/278

C08G 59/56 (2006.01) C08G 59/14 (2006.01) C08G 59/50 (2006.01)

Patent

CA 1335145

A curable epoxy composition has a long shelf life at ambient temperature. The composition comprises a mixture of a polyepoxide, an isocyanate and a salt of a polyamine and a polyhydric phenol and describes a process for curing the composition by heating it to a temperature in the range of from about 80°C to about 150°C.

556541

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