Thick film temperature sensitive device, and method and...

Details Thick film temperature sensitive device, and method and... Thick film temperature sensitive device, and method and...

G - Physics

01

N

356/107, 31/133,

G01N 27/14 (2006.01) H01C 7/02 (2006.01) H01C 17/065 (2006.01)

Patent

CA 1197087

ABSTRACT OF THE DISCLOSURE A thick film temperature sensitive device and method of making the same, comprising the steps of applying to the surface of a substrate and firing a resistance material comprising a mixture of glass frit and particles containing palladium and iron. The mixture is fired in a non oxidizing, neutral, or reducing atmosphere at a temperature between 700°C and 1100°C at which the glass frit softens. When cooled, a device is provided with a glass film strongly bonded to the substrate and having dispersed therein conductive metal particles of an alloy of palladium and iron. The device provides a relatively high positive temperature coefficient of resistance, a relatively high resistivity, and a resistance to temperature characteristic which is highly linear, and can be processed by spiralling and terminated by the use of electroless plating.

418941

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