Thermoelectric alloy composition

H - Electricity – 01 – L

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Details

31/191, 356/99

H01L 35/20 (2006.01) C22C 28/00 (2006.01) H01L 35/22 (2006.01)

Patent

CA 1266770

ABSTRACT OF THE DISCLOSURE A thermoelectric alloy composition is described comprising from 5% to 95% silicon, from 95% to 5% Germanium, from 0.01% to 0.2% lead and from 0% to 0.2% tin, all percentages being atomic percentages. In a preferred composition at least 50% silicon and 50% Germanium is present with 0.03% to 0.1% lead and from 0 to 0.05% time. Tin and lead in combination provide lower thermal conductivity and a greater figure of merit than with lead or tin alone. Other preferred compositions are provided and a thermoelectric material and a p-n coupling thermoelectric generator (10) incorporating the alloy is disclosed. The alloy composition provides high efficiency of power to heat loss and minimises running costs.

497017

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