Process for pretreating polyamide substrates for electroless...

Details Process for pretreating polyamide substrates for electroless... Process for pretreating polyamide substrates for electroless...

C - Chemistry, Metallurgy

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C

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C23C 18/04 (2006.01) C08J 7/12 (2006.01) C23C 18/28 (2006.01) H05K 3/18 (2006.01) H05K 3/38 (2006.01)

Patent

CA 1228267

Process for pretreating polyamide substrates for electro- less metallisation Abstract A mild activation process for the electroless metallisation of polyamide mouldings comprises treating the mouldings with a solution of a mixture of halides of elements of the 1st and 2nd main group of the Periodic Table (for example CaCl2) with salts of weak inorganic bases and strong inorganic acids (for example AlCl3) in a swelling agent or solvent for polyamides and with a metal-organic complex compound of elements of the 1st or 8th sub-group of the Periodic Table. The sequence is here immaterial. Le A 22 644

466912

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