Electroless copper plating rate controller

Details Electroless copper plating rate controller Electroless copper plating rate controller

C - Chemistry, Metallurgy

23

C

6/4, 117/80

C23C 18/54 (2006.01) C23C 18/38 (2006.01) C23C 18/40 (2006.01)

Patent

CA 1200952

IMPROVED ELECTROLESS COPPER PLATING RATE CONTROLLER ABSTRACT OF THE DISCLOSURE A process and composition for use in electroless copper plating where the process includes contacting a sub- strate with a solution comprising copper, a complexing agent, a reducing agent, and a pH adjuster. A stabilizer may also be used. The improvement of the present invention includes contacting the substrate with a solution further comprising ammonium ions present in an amount effective to function as a plating rate controller. The improved solution is relatively stable, easy to control, and is of versatile use.

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